APO Product Engineer (MJ0... 23k-34k

Responsibilities

1. Product Lifecycle Management：
61 Lead product engineering activities from design tape-out to mass production, including process characterization, design-for-manufacturability (DFM) reviews, and product qualification.
61 Define packaging solutions (e.g., fiber-to-chip coupling, heterogenous integration) to meet customer specifications and cost targets.
61 Develop and maintain product documentation, including control plans, failure mode effects analysis (FMEA), and standard operating procedures (SOPs).

2. New Product Introduction (NPI) & Yield Ramp-Up：

61 Collaborate with R&D, design, and packaging teams to drive CPO product innovations and ensure manufacturing readiness.
61 Analyze product characterization data (e.g., electro-optical performance) to validate functional targets and identify yield-limiting factors.
61 Optimize test strategies, including design-for-test (DFT) solutions and fault isolation methods, to improve production efficiency.

3. Continuous Improvement & Sustaining：
61 Monitor production metrics (e.g., yield, cycle time) using statistical process control (SPC) and drive corrective actions for quality issues.
61 Lead cost-reduction initiatives, process optimizations, and supplier collaborations to enhance product performance and scalability.
61 Resolve complex integration challenges, such as thermal management, signal integrity, and reliability failures, through root cause analysis.

4. Cross-Functional Collaboration
61 Work with optical, electrical, and test teams to align product requirements with manufacturing capabilities.
61 Interface with external partners (e.g., OSATs, vendors) to qualify new materials, equipment, and assembly processes.
61 Present technical updates to stakeholders and support customer engagements on product performance.

QUALIFICATIONS:
1.Education & Experience：
61 Bachelor’s or above in Electrical Engineering, Photonics, Optical Engineering, Materials Science, or a related field.
61 5+ years of product engineering experience in semiconductors/photonics, with a focus on silicon photonics, optical transceivers, or CPO technologies.
61 Proven track record of bringing complex optical products (e.g., SiPh chips, optical engines) from development to high-volume manufacturing.

2.Technical Expertise
61 Deep knowledge of CPO-specific technologies: silicon photonics integration, 2.5D/3D advanced packaging, fiber-to-chip coupling, and heterogenous assembly.
61 Proficiency in product characterization, DOE, failure analysis, and data analysis tools (e.g., JMP, Python) .
61 Understanding of photonic/electrical interconnect innovations (e.g., copper pillars, hybrid bonding) and industry trends.

3.Professional Competencies
61 Strong project management skills to lead timelines, budgets, and cross-functional teams .
61 Excellent problem-solving abilities to address integration issues and drive data-based decisions .
61 Fluency in English for global collaboration; communication skills to mentor junior engineers and engage stakeholders.