主任工艺工程师 15k-25k

Job Description:
1. Wire bond, die bond technology development include material & machine survey.
2. New product WB, DB process recipe and process flow definition, including machine model and material type, program create and maintain.
3. Stack thinning chip package development and introduction, package technology integration and project management.
4. Survey and estimate OSAT technology capability, process standard definition, package standard definition.
5. Wire bond, die bond process issue analysis, yield and efficiency improvement, cost simulation for new produce .
6. Wire bond, die bond standard document definition, training and testing operators.
Requirements:
1. Proficient in wire bonding/die bonding process, machine and material
2. Have the WB/DB package experience more than 5years.
3. Familiar with die bond, wire bond, back grinding, dicing process, etc.
4. Well know substrate, DAF, molding compound and other package material etc. Hands on skill for KnS wire bonder and ASM/Besi die bonder is proper.
5. Well know package design rule or package on package development experience is better.
6. Proficient in using AutoCAD to understand quality control management methods and tools, such as PFMEA, CP, SPC, MSA, etc., and have an understanding of reliability related knowledge.
7. Have good communication and teamwork skills.